AEM 006 - Electron Back Scatter Diffraction and Its Applications

Course Description

Certificate XI

Electron Backscattered Diffraction (EBSD)

1. July 13 2015, Overview, backscattered (and transmission) kikuchi diffraction pattern formation and collection (1.5h).
2. July 13 2015, Signal collection and on-line kikuchi pattern processing (1.5h)
3. July 14 2015, SEM setup and parameters for EBSD collection (1.5 h)
4. July 14 2015, Specimen preparation (1.5 h)
5. July 15 2015, Pole figures and texture analysis (1.5h)
6. July 15 2015, Orientation mapping and grain size analysis (1.5h)
7. July 16 2015, Semiconductor applications (1.5h)
8. July 16 2015, Crystallography of Si (1.5h)
9. July 17 2015, Metallurgical applications (1.5h)
10. July 17 2015, crystallography of Fe, Ti, Cu etc (1.5h)

EBSD Lab

1. July 13 2015, Overview of instrumentation, operation and maintenance (2h)
2. July 13 2015, Sample preparation lab Part I (2h)
3. July 13 2015, Introduction to crystallography Part I (2h)
4. July 14 2015, Setting up the SEM for EBSD acquisition (focus is on safety protocols to prevent severe damage to the instrument) (2h)
5. July 14 2015, Sample preparation lab Part II  (2h)
6. July 14 2015, Phase identification using simultaneous EDS and EBSD(2h)
7. July 15 2015, Offline Processing: Introduction to EBSD software(2h)
8. July 15 2015, Texture analysis of Semiconductor Device (2h)
9. July 15 2015, Introduction to crystallography Part II (2h)
10. July 16 2015, Offline processing: Pole Figures, and Texture analysis (2h)
11. July 16 2015, Grain size and strain analysis of metallurgical samples (2h)
12. July 16 2015, Introduction to crystallography Part III (2h)
13.  July 17 2015, Copper interconnect structure analysis with EBSD (2h)
14. July 17 2015, Offline processing: Mapping, noise reduction of maps and Grain size analysis (2h)
15. July 17 2015, Certificate Exam (1h)

Applies Towards the Following Certificates

• Engineering Certificate in Applied Electron Microscopy : Individual Electron Microscopy Course Listings