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Course Description

Certificate IV

 Transmission Electron Microscopy and Defects Analysis

 

  1. March 9 2015, TEM optics and instrumentation (1.5h)
  2. March 9 2015, Bloch waves, Electron Diffraction and pattern indexing of Crystals (1.5h).
  3. March 10 2015, Kikuchi Diffraction, Convergent Beam electron diffraction and their applications (1.5h)
  4. March 10 2015, Imaging theory, contrast in TEM, and HREM (1.5h)
  5. March 11 2015, Dislocation and planar defects Analysis (1.5h)
  6. March 11 2015, Strain analysis with CBED, NBD, and Electron holography (1.5h)
  7. March 12 2015, Silicon process induced defect analysis (1.5h)
  8. March 12 2015, Defect analysis in nanoparticles (1.5 h)
  9. March 13 2015, Metallic alloy defects, process, deformation (1.5h)
  10. March 13 2015, EM routine maintenance (1.5h)

 

 

 

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  1. March 9 2015, TEM optics, instrumentation, sample loading (2h)
  2. March 9 2015, Data processing with Digital Micrograph Part I (2h)
  3. March 9 2015, TEM system maintenance (2h)
  4. March 10 2015,TEM diffraction data acquisition (2h)
  5. March 10 2015, Diffraction pattern indexing (2h)
  6. March 10 2015, Large area TEM sample preparation Part I (2h)
  7. March 11 2015, Defect imaging by CBF/CDF and weak beam Part I (2h)
  8. March 11 2015, Defect analysis Part I (2h)
  9. March 11 2015, Large area TEM sample preparation Part II (2h)
  10. March 12 2015, Defect imaging by CBF/CDF and weak beam Part II (2h)
  11. March 12 2015, Defect analysis Part II (2h).
  12. March 12 2015, Large area TEM sample preparation Part III (2h)
  13. March 13 2015, HREM imaging acquisition (2h)
  14. March 13 2015, HREM image processing (2h)
  15. March 13 2015, Certificate exam (1h)

Applies Towards the Following Certificates

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