AEM 02 - Focus Ion beam Techniques and Applications

Course Description

Certificate II

 Focus Ion beam Techniques and Applications

1. 8am~9:30am November 17 2014,FIB Instrumentation and routine maintenance (1.5h)
2. 9:45am~11:15am November 17, 2014, Principle of FIB imaging, milling and deposition (1.5h)
3. 8am~9:30am November 18, 2014, Regular Cross-section TEM sample preparation with FIB (1.5h)
4. 9:45am~11:15am November 18, 2014, Special TEM sample preparation with FIB (1.5h)
5. 8am~9:30am November 19, 2014, Dual beam FIB for microelectronics failure analysis (1.5h)
6. 9:45am~11:15am November 19, 2014, GaAs device TEM sample preparation and Failure analysis (1.5h)
7. 8am~9:30am November 20, 2014, Milling Artefacts and Cross beam milling with live imaging (1.5h)
8. 9:45am~11:15am November 20, 2014, Focused ion beam deposition and enhanced etching
9. 8am~9:30am November 21, 2014, Micro and Nanofabrication: Circuit Editing (1.5h) (No Lab)

Dual Beam FIB/Lab

1. 12:30pm-2:00pm Group I: November 17 2014, Instrumentation, ion beam imaging, cross-section milling (2.5h)

2. 12:30pm-2:00pm Group II: November 17 2014, Microelectronic device topdown deprocessing Part I (2.5h)

3. 2:15pm-4:45pm Group I: November 17 2014, Microelectronic device topdown deprocessing Part I (2.5h)

4. 2:15pm-4:45pm Group II: November 17 2014, Instrumentation, ion beam imaging, cross-section milling (2.5h)

4. 12:30pm-2:00pm November 18 2014, TEM cross-section sample preparation Part I (2.5h)

5. 12:30pm-2:00pm Group II: November 18 2014, Microelectronic device topdown deprocessing Part II (2.5h)

7. 2:15pm-4:45pm Group I: November 19 2014, FIB/TEM cross-section sample preparation Part II (2.5h)

8. 12:30pm-2:00pm Group II: November 19 2014, Microelectronic device topdown deprocessing Part III (2.5h)

10. 2:15pm-4:45pm Group I: November 20 2014, FIB/Plan view TEM sample preparation Part I (2.5h)

11. 12:30pm-2:00pm November 20 2014 Microelectronic device backside deprocessing (2.5h)

13. 9:30am-12:00pm November 21 2014, FIB/Plan view TEM sample preparation Part II (2.5h)

14. 9:30am-12:00pm November 21 2014, Microelectronic device deprocessing review (2.5h)

13. 1:30pm-3:00pm November 21 2014, Microelectronic device deprocessing review (2.5h)

14. 1:30pm-3:00pm November 21 2014, FIB/Plan view TEM sample preparation Part II (2.5h)

15. 3:00pm-4:00pm November 21 2014, Certificate Exam (1h)

Applies Towards the Following Certificates

• Engineering Certificate in Applied Electron Microscopy : Individual Electron Microscopy Course Listings